Thermal Management
Industries Served:
Thermal Management - Gap Fillers & Gap Pads from Chomerics. Available as custom die-cut parts on request.
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Supersoft THERM-A-GAP® elastomers fill air pockets between hot components and heat sinks or metal chassis. Their flexible, elastic nature allows them to blanket highly uneven surfaces. Heat is conducted away from separate components or entire PCBs into metal covers, frames or spreader plates. THERM-A GAP® pads consist of ceramic-filled silicone and are provided in both electrically isolating form with fiberglass reinforcement, or laminated to aluminum foil for enhanced thermal conductivity to minimize hot spots. Applications include heat pipe assemblies, laptop PCs and automotive electronics. THERM-A-GAP® materials can be die-cut or molded into custom shapes. |
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CHO-THERM Pads One-component CHO-THERM insulators eliminate the need for messy, time-consuming thermal grease. Quickly applied CHO-THERM insulators can lower production costs and enhance production consistency. These advanced materials utilize silicone resins filled with boron nitride or aluminum oxide particles to achieve a range of thermal performance levels. Typical applications include power conversion equipment, power supplies and UPS systems, power semiconductors and automotive electronics. CHO-THERM pads are available in sheets, roll form, or die-cut for use with standard semiconductors. Materials are available with thermal impedance as low as 0.19°C-in2/W. |
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THERMATTACH T410 tapes attach heat sinks to plastic packages, and T411 tapes are designed to conform to out-of-flat plastic package surfaces. Electrically isolating and non-isolating versions of THERMATTACH tapes are available. |
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The THERMFLOW family of phase-change thermal interface materials combines the consistency and ease of use of elastomeric pads with the low thermal impedance of thermal grease. This winning combination makes Chomerics’ THERMFLOW materials an excellent choice for today’s most demanding thermal interface applications. Each pad consists of a thin, dry film that softens at microprocessor operating temperatures and completely fills interfacial air gaps and voids typically found between component packages and heat sinks. The THERMFLOW family provides materials with thermal impedance as low as 0.03°C-in2/W. Applications include microprocessors, power semiconductors, DC/DC converters, and exposed die BGAs. |
