THERM-A-GAP® Gap Pads & Fillers 

THERM-A-GAP® gap pads and gap fillers from Chomerics

Supersoft THERM-A-GAP® gap pads and gap fillers provide thermal management options that fill air pockets between hot components on heat sinks or metal chassis. Their flexible, elastic nature allows them to blanket highly uneven surfaces. Heat is conducted away from separate components or entire PCBs into metal covers, frames or spreader plates. THERM-A-GAP® pads consist of ceramic-filled silicone and come in both an electrically isolating form with fiberglass reinforcement, or a laminated  aluminum foil for enhanced thermal conductivity to minimize hot spots. Applications include heat pipe assemblies, laptop PCs and automotive electronics. THERM-A-GAP® materials can be die-cut or molded into custom shapes for thermal management performance.

Chomerics THERM-A-GAP® 569, 570, 579 and HCS10 datasheet

CHO-THERM pads are one-component insulators that eliminate the need for thermal grease. CHO-THERM insulators can lower production costs and enhance production consistency. These materials use silicone resins with boron nitride or aluminum oxide particles to achieve a range of thermal performance. Typical applications include power conversion equipment, power supplies, power semiconductors and automotive electronics. CHO-THERM pads are available in sheets, roll form, or die-cut for use with standard semiconductors, and have a thermal impedance as low as 0.19°C-in2/W.

THERMATTACH® T410 tapes attach heat sinks to plastic packages, and T411 tapes are designed to conform to out-of-flat plastic surfaces. Electrically isolating and non-isolating versions of THERMATTACH® tapes are available.

THERMFLOW® phase-change thermal interface materials combine the consistency and ease of elastomeric pads, with the low thermal impedance of thermal grease, making Chomerics THERMFLOW® materials an excellent choice in thermal applications. Pads are a thin, dry film that softens at microprocessor operating temperatures and fills interfacial air gaps and voids between component packages and heat sinks. The THERMFLOW® materials offer thermal impedance as low as 0.03°C-in2/W for microprocessors and DC/DC converters.